3D Printing Industry Tecology
The country has vigorously promoted intelligent manufacturing and 3D digital industry, and enterprises are increasingly in urgent need of talents who understand 3D software technology, 3D scanning, 3D printing and other digital manufacturing technologies. In this historical transformation period of China from a manufacturing power to a manufacturing power, more and more schools have begun to build 3D digital industry teaching bases, so that students can access the latest 3D software, 3D printing technology, and cultivate the interest and ability of innovation and creation, And it has the technical capability of 3D digital manufacturing required by enterprises.
Photosensitive Resin for Safe 3D Printing DSM somos momentum
Imported resin
Category:
Resin
Product accessories:
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Product description
Momentum is a photosensitive resin with a pink SLA. The printed sample has a fine and wide surface, precise size and durability, and is widely used in the shoe mold industry.
Our Somos photosensitive resin material is a high-quality option for 3D printing in a variety of applications. With exceptional precision and durability, our material ensures high-quality prints that meet your needs.
Our Somos photosensitive resin material is compatible with various 3D printing technologies, including Stereolithography (SLA) and Digital Light Processing (DLP). It provides excellent detail and surface quality, making your prints look refined.
Our Somos photosensitive resin material is highly durable and can withstand high temperatures and pressures. It also exhibits excellent chemical stability, making it an ideal material for prototyping, simulation, and mold making.
Our Somos photosensitive resin material can be used in various applications, including medical devices, automotive, aerospace, consumer goods, and industrial manufacturing. Whether you need high-precision prototyping or production-grade manufacturing, our Somos photosensitive resin material can meet your needs.
|
Mechanical Behavior |
UV post curing |
||
|
ASTM |
Performance description |
Metric |
English system |
|
D638M |
Tensile modulus |
2,510 MPa |
364 ksi |
|
D638M |
tensile strength |
37 MPa |
5.4 ksi |
|
D638M |
Elongation at break |
7.5% | |
|
D638M |
elongation at yield |
3% | |
|
D790M |
Bending strength |
67.3 MPa |
9.8 ksi |
|
D2240 |
Flexural modulus |
2,200 MPa |
319 ksi |
|
D256A |
Notch impact strength |
26 J/m |
0.49 ft-lb/in |
|
D638M |
Poisson's ratio (transverse deformation coefficient) |
0.41 | |
|
D2240 |
Hardness (Shore D) |
79 | |
|
D570-98 |
Water absorption |
0.4% | |
|
Thermal/electrical performance |
UV post curing | ||
|
ASTM |
Performance description |
Metric |
English system |
|
E831-05 |
C.T.E. -40-0°C (-40-32°F) |
63 μm/m°C |
35 μin/in°F |
|
E831-05 |
C.T.E. 0-50°C (32-122°F) |
89 μm/m°C |
49 μin/in°F |
|
E831-05 |
C.T.E. 50-100°C (122-212°F) |
170 μm/m°C |
95 μin/in°F |
|
E831-05 |
C.T.E. 100- 50°C (212-302°F) |
172 μm/m°C |
96 μin/in°F |
|
D150-98 |
Dielectric Constant 60Hz |
3.8 | |
|
D150-98 |
Dielectric Constant 1KHz |
3.7 | |
|
D150-98 |
Dielectric Constant 1KHz |
3.4 | |
|
D149-97A |
Dielectric Strength |
17.9 kV/mm |
454 V/mil |
|
D648 |
Hot deformation temperature at 0.46 MPa (66 psi) |
46°C |
115°F |
|
D648 |
Thermal deformation temperature at 1.81 MPa (264 psi) |
41°C |
106°F |
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