UV-Curable Photosensitive Resin for More Efficient Production CHR9600Y
Prototype material
Category:
Resin
Product accessories:
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Product description
CHR9600Y is a yellow-green liquid SLA photosensitive resin, which has the advantages of good toughness and fast reaction efficiency, good dimensional stability, and its performance is close to or similar to that of ABS material. It is used for solid laser curing and solid molding. It is widely used in the production of master molds, conceptual models, and functional parts in the industrial fields of automobile, architecture, decoration, hand boards, industrial parts assembly and testing.
Our photosensitive resin material is an excellent choice for 3D printing in a variety of applications. With exceptional precision and durability, our material ensures high-quality prints that meet your needs.
Our photosensitive resin material is compatible with various 3D printing technologies, including Stereolithography (SLA) and Digital Light Processing (DLP). It provides excellent detail and surface quality, making your prints look refined.
Our photosensitive resin material is highly durable and can withstand high temperatures and pressures. It also exhibits excellent chemical stability, making it an ideal material for prototyping, simulation, and mold making.
Our photosensitive resin material can be used in various applications, including medical devices, automotive, aerospace, consumer goods, and industrial manufacturing. Whether you need high-precision prototyping or production-grade manufacturing, our photosensitive resin material can meet your needs.
MEASUREMENT |
TEST METHOD |
VALUE(After UV curing) |
Hardness, Shore D |
ASTM D 2240 |
76~85 |
Flexural modulus, Mpa |
ASTM D 790 |
2,680-2,788 |
Flexural strength, Mpa |
ASTM D 790 |
70-76 |
Tensile strength, MPa |
ASTM D 638 |
40-55 |
Elongation at break |
ASTM D 638 |
7-11% |
Impact strength notched Izod, J/m |
ASTM D 256 |
32-38 |
Notch impact strength |
||
Heat deflection temperature, ℃ |
ASTM D 648 @66PSI |
60~78 |
Thermal deformation temperature |
||
Density, g/cm3 |
1.13~1.18 |
|
Dielectric Constant |
ASTM D 150-98 |
4.1~5.0 |
60 Hz |
0.46% |
|
Water absorption |
ASTM D 570-98 |
|
Viscosity |
405~500 cps @ 25 ℃ |
|
Dp |
0.135~0.152 mm |
|
Ec |
8.9~9.5 mJ/cm2 |
|
Building layer thickness |
0.05~0.12mm |
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